Fincom Tech Launched Science Fair

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Fincom Technologies, through its SchoolPay platform, partnered with the Uganda Catholic Education Department to host the first National Catholic Schools Science Fair, bringing together pupils from all 19 dioceses. Each diocese nominated five learners who presented projects in technology, engineering, environmental conservation, and problem-solving. Officials said the initiative expands STEM access, strengthens digital learning, and supports the Competence-Based Curriculum. Church leaders emphasized their role in building scientific literacy and preparing learners for a tech-driven future.